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Migrate to the next-version Soldeer release lifecycle (bump [package].version) #24

Description

@thedavidmeister

The shared rainix-autopublish reusable switched from the old auto-bump Soldeer model to a next-version release lifecycle (rainlanguage/rainix#264, merged). Your .github/workflows/package-release.yaml pins the reusable at @main, so the new behaviour is already live.

What changed

[package].version in foundry.toml is now the NEXT, in-development (unpublished) version — it must be strictly ahead of the latest published Soldeer revision. On a Solidity content change the workflow publishes that in-dev version, then bumps [package].version to the next and commits it. The gate fails loud if the in-dev version is not ahead of the registry (no more silent auto-bump).

This repo needs a one-time bump

  • foundry.toml [package].version = 0.1.0
  • latest published rain-sol-codegen revision = 0.1.0 (equal — not ahead)

On the next merge that changes Solidity content, autopublish will fail with:

foundry.toml [package].version (0.1.0) is not ahead of the published revision (0.1.0); the next-version lifecycle needs it to be the next UNPUBLISHED version — bump [package].version above 0.1.0.

Action: bump [package].version to 0.1.1 in foundry.toml (the next unpublished patch). After that the lifecycle self-maintains — each publish bumps ahead automatically, no manual bumps thereafter.

If this repo generates per-release artifacts keyed by version

(e.g. src/generated/*.pointers.sol deploy-address snapshots) also pass soldeer-generate-cmd: in the package-release.yaml reusable call, so the post-publish bump re-freezes them born-green. Pure library repos with nothing generated can skip this. Reference wiring: S01-Issuer/st0x.deploy#243.

Ref: rainlanguage/rainix#264

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